BILAflor®
This high quality 2-layer parquet combines all advantages of glue-down parquet with those of engineered wood floors. The bottom layer made of rift-grained spruce and plywood bands on the front edges ensure a stable connection construction.
- 2-layer engineered wood flooring
- High-quality glue down installation on screeds and woode composite subfloors
- Sealing of the single strips avoids pulling down joints
- 100% made in Austria using solar energy
- Finished surface SEDA, PUROTEC or TENSEO
- Guaranteed made of real wood
- Approx. 3.6 mm wear layer from solid wood - multiple renovations possible
- Suitable for underfloor heating systems, thermal insulaton resistance RT = 0.078 m2K/W
- Different installation patterns
- Supports a natural and healthy room climate, hygienic and easy to care for
- 30 years warranty in the private sector
Less is
more Flo_r.
Parquet that brings your house to life. Different lengths and variations make the range a favourite when it comes to stylish design.
In addition to the classic irregular and brick pattern, BILAflor® parquet also offers you absolutely trendy herringbone parquet- the classical one and also double or triple herringbone. Of course, all of the products can be combined with one another.
Available dimensions
BILAflor 28.1200 2-Strip
Dimensions: 9.5 x 120 x 1200 mm
Wear layer: approx. 2.8mm +- 10%, suitable for the installation on underfloor heating systems: RT = 0.053 m2K/W
BILAflor 1000 1-Strip
Dimensions: 11 x 90 x 1000 mm
Wear layer: approx. 3.6 mm, suitable for the installation on underfloor heating systems: RT = 0,078 m2K/W
BILAflor 500 1-Strip
Dimensions: 11 x 70 x 500mm
Wear layer: approx. 3.6 mm, suitable for the installation on underfloor heating systems: RT = 0,078 m2K/W
Order your free BILAflor
parquet sample!
To make it easier for you to choose your new parquet floor, we offer you the possibility to order up to 4 samples in one package to your home free of charge. The samples are ideal for showing the type of construction, the color tone, the surface and haptics.